The name is absent

Random variations result from arbitrary fluctuations in the manufacturing
process. These variations can be decomposed into inter-die ≠^inter and intra-die
variations ≠^intra. Inter-die variations represent the differences among the dies for
the same wafer. Inter-die variation is a random variable equaling some constant
value for each chip. Intra-die variations represent the differences among the
devices on one chip. Thus, the total random variation for gate и is

c = ≠^inter+c^tra∙

Finally, total variation can be written as

≠u = C+≠u

= α₀ + a₁x_u + a₂y_u + ≠^inter + C^tra

= Fj^,∕5 + C^ra                               (2-1)

Where F_u = [l,a⅛, y_u]^τ and β = [ɑɑ + C^tθ^r> ^αι> ^α2]^τ∙ Note that F_u contains the
gates location information. The term F_u β for a specific gate is constant. C^tra
is a Gaussian random vector with zero mean and correlation matrix Σ [47]

∑u,υ = p{F_u - F_v).

p is the correlation function and can have three forms [47]: p(∙) = exp(-α²∣∣ ∙ ∣∣)
(exponential), p(∙) = exp(-α²∣∣ ∙ ∣∣²) (Gaussian), or /?(•) = max{0,1 — α²∣∣ ∙ ∣∣}
(linear).

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